Dual Coil Patterned Ultra‐Thin Silicon Film Enable by Double‐Sided Process

Double-sided microfabrication process on an ultra-thin silicon film has rarely been attempted due to the challenges in terms of preparation and handling a thin spite its promising fabrication potentials. Such allows for doubling device density or providing dual functionalities depending whether front back sides are processed identically distinctively. Here, novel double-sided processing strategy is introduced by realizing coil patterned that working as actuating energy harvesting system. Experimentally, enabled using approach shows remarkably enhanced performance when compared with single counterpart. Furthermore, multiphysics simulation model developed resultant modeling data validate experimentally measured enhancement. Finally, structural durability upon cyclic loading tested diverse vibration modes investigated.